Kester Soldering Products
Kester NXG33 Lead-Free Soldering Paste
Kester NXG33 is designed to exceed customers’ expectations for high yield lead-free manufacturing. NXG33 is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically as bright as SnPb joints. Prints down to 01005 pad sites. Designed to be reflowable in air as well as nitrogen. Post soldering, NXG33 offers minimized defects, including head-in-pillow and QFN/BGA voiding.Read more
Kester Ultrapure K100LD Soldering Bar
Kester Ultrapure K100LD Soldering Bar is a near eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.Read more
Amazing service! Your Kester products and prices are top of the line! Many thanks!
Great looking site! We are really happy with the way we work with John, it’s a pleasure doing business in such professional and in the same time friendly manner.